ASEM 6300P-EW1
Fanless Panel IPCs with Intel® Elkhart Lake platform
Lifecycle status: Active
- 10.4‘, 12.1’ and 15‘ TFT LCD in 4:3 format, 17’ and 19‘ in 5:4 format and 12.1’, 15.6‘, 18.5’, 21.5‘ and 24’ in Wide format with up to Full HD resolution
- Aluminium (AF), aluminium True Flat (AT) and stainless steel True Flat (SR) front panels with resistive touchscreen
- Aluminium and True Flat glass front panels with capacitive back-projected multitouch touchscreen (GL)
- Intel Atom® x6425E quad-core 2.00 GHz processor of the Elkhart Lake PCH SoC generation, over 300% higher performance than our previous QT/HT/PB/BM2200 family
- Up to 16GB RAM with ECC support, essential for mission critical and real time applications due to superior reliability and guaranteed data integrity
- Up to 3 simultaneous storage options: M.2 SSD, 2.5’ SSD and CFast
- Fanless IPC ensuring operation between 0 and 50 °C without the need for mechanical ventilation
- ATX functionality for remote power on and native support for our new Smart UPS (coming soon)
- 256kB MRAM for saving retention variables (optional)
- Available in SL version with reduced depth, S0 version with the possibility to install additional interfaces and S1 version with one PCI or PCIe expansion slot
- BIOS ThinManager® ready pre-installed
- FactoryTalk® Remote Access™ remote support software included (UBIQUITY compatible)
- FactoryTalk® Optix™ software for HMI and Edge Computing applications (optional)
Front panel design
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ASEM 6300P-EW1xxA
Aluminum Frame (AF)
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ASEM 6300P-EW1xxB
Aluminum TrueFlat (AT)
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ASEM 6300P-EW1xxC
Glass (GL)
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ASEM 6300P-EW1xxD
Stainless Steel (SR)
Versions
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ASEM 6300P-EW1xxxxAA (SL)
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ASEM 6300P-EW1xxxxAB (S0)
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ASEM 6300P-EW1xxxxAC (S1)
technical data
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